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Micron Technology Assigned Patent for Electronic Device Assemblies

Oct 18, 2019 - Targeted News Service

ALEXANDRIA, Va., Oct. 18 -- Micron Technology, Boise, Idaho, has been assigned a patent (No. 10,448,509, initially filed July 13, 2015) developed by three co-inventors for an "electronic device assemblies including conductive vias having two or more conductive elements." The co-inventors are David J. Corisis, Nampa, Idaho, Choon Kuan Lee, Singapore, and Chin Hui Chong, Singapore.

The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d...